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Copper silicide

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Title: Copper silicide  
Author: World Heritage Encyclopedia
Language: English
Subject: Caesium hexafluorocuprate(IV), Potassium hexafluorocuprate(III), Copper(II) azide, Copper(II) tetrafluoroborate, Copper(II) phosphate
Collection: Copper Compounds, Silicides, Transition Metal Silicides
Publisher: World Heritage Encyclopedia

Copper silicide

Copper silicide
Molar mass 345.8155 g/mol
Appearance silver powder
Melting point 825 °C (1,517 °F; 1,098 K)
US health exposure limits (NIOSH):
PEL (Permissible)
TWA 1 mg/m3 (as Cu)[1]
REL (Recommended)
TWA 1 mg/m3 (as Cu)[1]
TWA 100 mg/m3 (as Cu)[1]
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
 N  (: YesY/N?)

Copper silicide (Cu5Si), also called pentacopper silicide, is a binary compound of silicon with copper. It is an intermetallic compound, meaning that it has properties intermediate between an ionic compound and an alloy. This a solid crystalline material is a silvery solid that is insoluble in water. It forms upon heating mixtures of copper and silicon.


Copper silicide thin film is used for passivation of copper-based chips, where it serves to suppress diffusion and electromigration and serves as a diffusion barrier.[2]

Copper silicides are invoked in the methyl chloride to silicon. An illustrative reaction affords the industrially useful dimethyldichlorosilane:[3]

2 CH3Cl + Si → (CH3)2SiCl2


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