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List of integrated circuit package dimensions

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Title: List of integrated circuit package dimensions  
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Subject: Semiconductor packages, Small Outline Diode, TO-66, DO-214, TO-126
Collection: Electronics Lists, Semiconductor Packages
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List of integrated circuit package dimensions

Various form factors are used in integrated circuit packaging, some of which are described below.

Contents

  • Dimension reference 1
    • Surface-mount 1.1
    • Through hole 1.2
  • Package dimensions 2
    • Dual row 2.1
    • Quad rows 2.2
  • See also 3
  • References 4
  • External links 5

Dimension reference

Surface-mount

A general surface mount chip, with major dimensions.

  C - Clearance between IC body and PCB
  H - Total Height
  T - Lead Thickness
  L - Total Carrier Length
  LW - Lead Width
  LL - Lead Length
  P - Pitch

Through hole

A general through hole pin chip, with major dimensions.

  C - Clearance between IC body and board
  H Total Height
  T - Lead Thickness
  L - Total Carrier Length
  LW - Lead Width
  LL - Lead Length
  P - Pitch
  WB - IC Body Width
  WL - Lead-to-Lead Width-

Package dimensions

All measurements below are given in mm. To convert mm to thou, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 thou).

  • C - Clearance between package body and PCB.
  • H - Height of package from pin tip to top of package.
  • T - Thickness of pin.
  • L - Length of package body only.
  • LW - Pin width.
  • LL - Pin length from package to pin tip.
  • P - Pin pitch (distance between conductors to the PCB).
  • WB - Width of the package body only.
  • WL - Length from pin tip to pin tip on the opposite side.

Dual row

Image Family Pin Name Package WB WL H C L P LL T LW
DIP Y Dual Inline Package 8-DIP 6.2-6.48 7.62 7.7 9.2-9.8 2.54 (1/10 inch) 3.05-3.6 1.14-1.73
32-DIP 15.24 2.54 (1/10 inch)
LFCSP N Lead Frame Chip Scale Package 0.5
MSOP Y Mini Small Outline Package 8-MSOP 3 4.9 1.1 0.10 3 0.65 0.95 0.18 0.17 - 0.27
10-MSOP 3 4.9 1.1 0.10 3 0.5 0.95 0.18 0.17 - 0.27
16-MSOP 3 4.9 1.1 0.10 4.04 0.5 0.95 0.18 0.17 - 0.27
SO
SOIC
SOP
Y Small Outline Integrated Circuit 8-SOIC 3.9 5.8-6.2 1.72 0.10-0.25 4.8-5.0 1.27 1.05 0.19-0.25 0.39-0.46
14-SOIC 3.9 5.8-6.2 1.72 0.10-0.25 8.55-8.75 1.27 1.05 0.19-0.25 0.39-0.46
16-SOIC 3.9 5.8-6.2 1.72 0.10-0.25 9.9-10 1.27 1.05 0.19-0.25 0.39-0.46
16-SOIC 7.5 10.00-10.65 2.65 0.10-0.30 10.1-10.5 1.27 1.4 0.23-0.32 0.38-0.40
SOT Y Small Outline Transistor SOT-23-8 1.6 2.8 1.45 2.9 0.95 0.6 0.22-0.38
SSOP Y Shrink Small-Outline Package
TDFN ? Thin Dual Flat No-lead 8-TDFN 3 3 0.7-0.8 3 0.65 N/A 0.19-0.3
TSOP Y Thin Small-Outline Package
TSSOP Y Thin Shrink Small Outline Package 8-TSSOP 4.4 6.4 1.2 0.15 3 0.65 0.09-0.2 0.19-0.3
µSOP Y Micro Small Outline Package[1] µSOP-8 4.9 1.1 3 0.65

Quad rows

Image Family Pin Name Package WB WL H C L P LL T LW
PLCC N Plastic Leadless Chip Carrier
CLCC N Ceramic Leadless Chip Carrier 48-CLCC 14.22 14.22 2.21 14.22 1.016 N/A 0.508
LQFP Y Low-profile Quad Flat Package
TQFP Y Thin Quad Flat Pack TQFP-44 10.00 12.00 0.35-0.50 0.80 1.00 0.09-0.20 0.30-0.45
TQFN N Thin Quad Flat No-lead

See also

References

  1. ^ http://pdfserv.maximintegrated.com/package_dwgs/21-0036.PDF

External links

  • JEDEC JEP95 official list of all (over 500) standard electronic packages
  • Intersil packaging information
  • ICpackage.org
  • Solder Pad Layout Dimensions
  • International Microelectronics And Packaging Society
  • The Component Package Database
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